Silicon Wafer Production and Specifications
prox. 2 mm, since the polishing machines cannot accommodate thicker wafers. A limitation of the wafer thickness downwards to approx. 200 μm as given by many manufacturers, is due to the risk of fracture Fig. 21: The dependency of the el. resistance of the doping concentration (boron and phosphorus or arsenic) in crystalline silicon. Because at ...
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SiC Wafer Grinding - Engis
Silicon Carbide Wafer Grinding The EVG-250/300 series Vertical Grinding Machine combined with Engis MAD Grinding Wheels can achieve a superior surface finish on silicon carbide wafers to reduce or even eliminate loose abrasive lapping steps. The machine can be customized to your needs: Auto dressing In process thickness measurement
Walk-Behind Milling Machines and Floor Grinders
amount of silica dust that becomes airborne when milling or grinding silica containing materials because it controls the exposure at its source. The silica standard specifies the use of walk-behind milling machines and floor grinders that are equipped with an integrated water delivery system that continuously delivers water to the cutting surface.
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Grinding and Polishing - ASM International
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